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Author
Lima, Frederico (6)
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2014
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2018
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2012
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Conference Proceeding
(4)
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CD-ROM
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Copper diffusion
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SNMS
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Scratch test
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Seedless electroplating
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Silicon plating
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Copper electrodeposition on silicon electrodes
(2018)
Lima, Frederico
;
Mescheder, Ulrich
;
Müller, C.
;
Reinecke, Holger
Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers
(2018)
Lima, Frederico
;
Mescheder, Ulrich
;
Katona, Gabor L.
;
Leiste, Harald
;
Özel, Emre
;
Müller, Claas
;
Reinecke, Holger
Electrochemical Impedance Spectroscopy of n-Si(100) Pre-etched by KOH or BHF
(2014)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Maskless Selective Electrodeposition on Silicon
(2014)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Simulation of Current Density for Electroplating on Silicon Using a Hull Cell
(2012)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon
(2015)
Lima, Frederico
;
Reinecke, Holger
;
Mescheder, Ulrich
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6