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- Atomic layer deposition (ALD) (2)
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- Active implant (1)
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Course of studies
Atomic Layer Deposition of Bioactive TiO2 Thin Films on Polyetheretherketone for Orthopedic Implants
(2021)
Passivated electrode side walls by atomic layer deposition on flexible polyimide based samples
(2020)
Investigation on adhesion strength of Parylene-C coatings with different adhesion promotion methods
(2021)
Delamination of encapsulation materials (here the polymer Parylene-C) is one of the biggest failure mechanisms for active medical implants. This problem is addressed by the application of different pre-treatment and adhesion promotion methods. The methods applied in this research are oxygen and Silane A-174 solution pre-treatment and Silane A-174, titanium oxide and Trimethylsilane as adhesion promoters. The adhesion forces of these methods are quantified after different soaking times in phosphate buffered saline (PBS) solution to mimic environment of the human body.
Feasibility of Parylene C for encapsulating piezoelectric actuators in active medical implants
(2023)
Parylene C is well-known as an encapsulation material for medical implants. Within the approach of miniaturization and automatization of a bone distractor, piezoelectric actuators were encapsulated with Parylene C. The stretchability of the polymer was investigated with respect to the encapsulation functionality of piezoelectric chips. We determined a linear yield strain of 1% of approximately 12-μm-thick Parylene C foil. Parylene C encapsulation withstands the mechanical stress of a minimum of 5×105 duty cycles by continuous actuation. The experiments demonstrate that elongation of the encapsulation on piezoelectric actuators and thus the elongation of Parylene C up to 0.8 mm are feasible.