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Reinecke, Holger (1)
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2018 (1)
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Article (peer-reviewed)
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English
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Seedless electroplating (1)
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Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers
(2018)
Lima, Frederico
;
Mescheder, Ulrich
;
Katona, Gabor L.
;
Leiste, Harald
;
Özel, Emre
;
Müller, Claas
;
Reinecke, Holger
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