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Author
Burghartz, Joachim N. (1)
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Year of publication
2023
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Article (peer-reviewed)
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English
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Encapsulation (1)
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Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates
(2023)
Passlack, Ulrike
;
Simon, Nicolai
;
Bucher, Volker
;
Harendt, Christine
;
Stieglitz, Thomas
;
Burghartz, Joachim N.
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