Local laser bonding for low temperature budget

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Author:Ulrich MeschederORCiDGND, M. Alavi, K. Hiltmann, Ch. Lietzau, Christoph Nachtigall, H. Sandmaier
DOI:https://doi.org/10.1016/S0924-4247(01)00871-8
ISSN:0924-4247
Parent Title (English):Sensors and Actuators A: Physical
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2002
Release Date:2018/02/27
Tag:Eutectic bonding; Laser micromachining; Wafer bonding
Volume:97-98.2002
Issue:April
First Page:422
Last Page:427
Access Rights:Innerhalb der Hochschule
Licence (German):License LogoEs gilt das UrhG