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Transfer, Assembly and Embedding of Small CMOS-Die Arrays for the Build-up of Flexible Smart Implants
Author: | Andreas HeidGND, Marcio Camoleze de Andrade, Lena Bleck, Rene P. von Metzen, Dieter Kern, Jürgen Giehl, Volker BucherORCiDGND |
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DOI: | https://doi.org/10.1109/TCPMT.2019.2900564 |
ISSN: | 2156-3950 |
Parent Title (English): | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Document Type: | Article (peer-reviewed) |
Language: | English |
Year of Completion: | 2019 |
Release Date: | 2019/03/20 |
Tag: | Adhesives; Polymers; Printing; Substrates; Surface treatment |
Volume: | 9.2019 |
Issue: | 7 |
First Page: | 1415 |
Last Page: | 1425 |
Open-Access-Status: | Closed Access |
Licence (German): | Urheberrechtlich geschützt |