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Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique

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Metadaten
Author:Shervin KeshavarziORCiD, Ulrich MeschederORCiDGND, Holger Reinecke
DOI:https://doi.org/10.1109/MEMSYS.2015.7050977
ISBN:978-1-4799-7955-4
Parent Title (English):28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015
Document Type:Conference Proceeding
Language:English
Year of Completion:2015
Release Date:2016/12/13
Tag:Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Temperature measurement
First Page:413
Last Page:416
Open Access:Frei verf├╝gbar
Licence (German):License LogoEs gilt das UrhG