Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique
Author: | Shervin KeshavarziORCiDGND, Ulrich MeschederORCiDGND, Holger Reinecke |
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DOI: | https://doi.org/10.1109/MEMSYS.2015.7050977 |
ISBN: | 978-1-4799-7955-4 |
Parent Title (English): | 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015 |
Document Type: | Conference Proceeding |
Language: | English |
Year of Completion: | 2015 |
Release Date: | 2016/12/13 |
Tag: | Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Temperature measurement |
First Page: | 413 |
Last Page: | 416 |
Open-Access-Status: | Open Access |
Licence (German): | Urheberrechtlich geschützt |