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Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon

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Metadaten
Author:Frederico Lima, Holger Reinecke, Ulrich MeschederORCiDGND
ISBN:978-3-8007-4100-7
Parent Title (German):MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe
Publisher:VDE-Verlag
Place of publication:Berlin
Document Type:Conference Proceeding
Language:English
Year of Completion:2015
Release Date:2016/12/14
Tag:CD-ROM
First Page:409
Last Page:412
Open Access:Frei verf├╝gbar
Licence (German):License LogoEs gilt das UrhG