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Novel method for plasma etching of printed circuit boards as alternative for fluorocarbon gases

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Author:Wolfram KintzelGND, Marvin Schmid, Achim Rentschler, Jörg Eisenlohr, Volker BucherORCiDGND
DOI:https://doi.org/10.34343/ijpest.2023.17.e02002
ISSN:2435-0125
Parent Title (English):International Journal of Plasma Environmental Science and Technology : ISNTPT
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2023
Release Date:2023/06/23
Tag:Fluorocarbon; HFC; PCB; Plasma etching; Printed circuit board
Volume:17.2023
Issue:2
Article Number:e02002
Page Number:19
Open-Access-Status: Open Access 
 Gold 
Licence (German):License LogoUrheberrechtlich geschützt