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Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers (2018)

Lima, Frederico ; Mescheder, Ulrich ; Katona, Gabor L. ; Leiste, Harald ; Özel, Emre ; Müller, Claas ; Reinecke, Holger

Copper electrodeposition on silicon electrodes (2018)

Lima, Frederico ; Mescheder, Ulrich ; Müller, C. ; Reinecke, Holger

Effect of Capillary Forces in Room Temperature Si-Si Direct Bonding Technique Using Velcrolike Surfaces (2017)

Keshavarzi, Shervin ; Mescheder, Ulrich ; Reinecke, Holger

Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces (2016)

Keshavarzi, Shervin ; Mescheder, Ulrich ; Reinecke, Holger

Formation Mechanisms of Self-Organized Needles in Porous Silicon Based Needle-Like Surfaces (2018)

Keshavarzi, Shervin ; Mescheder, Ulrich ; Reinecke, Holger

Generation of microstructures on a Ti–6Al–4V substrate through anodization (2015)

Soares, Tiago A. ; Mozaffari-Jovein, Hadi ; Reinecke, Holger

Open Access