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Investigations to improve the adhesion between the PECVD coated silicon carbide thin films and monocrystalline (110) silicon wafer substrate is reported. The surface treatment of silicon wafer is realized by roughening the wafer surface by wet etching in 1.8M potassium hydroxide solution at 50°C with ultrasonic agitation. The average surface roughness of the silicon wafer was increased from 2.9 nm for polished wafer to a range between 32 nm to 250 nm by wet etching for a duration of 10 minutes to 55 minutes, respectively. The adhesion between the PECVD coated silicon carbide thin films (ca. 300 nm thickness) and the silicon wafers with varying surface roughness was characterized by means of scanning scratch test. The critical load initially increased from 153 mN to 169 mN on increasing the average surface roughness from 2.9 nm to 33 nm, respectively. While with further increase in average surface roughness adversely in-fluenced the adhesion indicated by a gradual decrement in the critical load to 124 mN for the maximum investigated average surface roughness of 250 nm.
In situ Qualitätsbeurteilung von Schleifprozessen mittels Mikrosystemtechnik basierter Sensorfusion
(2020)
Microfabricated 2D inductive eddy-current transducers operating in a reflection differential transmitter-receiver mode are presented for the micro nondestructive detection of micro grinding burn. 2D spiral circular microcoils are employed as excitation coils, while an innovatively conceptualized “interconnected split-D” type differential microcoil is used as a sensing coil. Finite element modelling using COMSOL revealed the efficacy of proposed concept in non-destructive testing of small grinding burn having a width of 100 µm. The induced sensing coil voltage changed as a function of presence of grinding burn, with successful recording of the signal for the investigated lift-off range of 250 µm - 1000 µm for 100 kHz to 1 MHz driving frequencies of excitation coil. Experimental validation showed a 94% increase in the induced voltage of the sensing coil in presence of grinding burn on increasing the driving frequency of excitation coil from 100 kHz to 1 MHz. Thereby, revealing the superficial nature of the grinding burn defect, and showing the efficacy of the proposed concept for the non-destructive testing of grinding burn.