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Novel method for plasma etching of printed circuit boards as alternative for fluorocarbon gases
(2023)
Feasibility of Parylene C for encapsulating piezoelectric actuators in active medical implants
(2023)
Parylene C is well-known as an encapsulation material for medical implants. Within the approach of miniaturization and automatization of a bone distractor, piezoelectric actuators were encapsulated with Parylene C. The stretchability of the polymer was investigated with respect to the encapsulation functionality of piezoelectric chips. We determined a linear yield strain of 1% of approximately 12-μm-thick Parylene C foil. Parylene C encapsulation withstands the mechanical stress of a minimum of 5×105 duty cycles by continuous actuation. The experiments demonstrate that elongation of the encapsulation on piezoelectric actuators and thus the elongation of Parylene C up to 0.8 mm are feasible.
Atomic Layer Deposition of Bioactive TiO2 Thin Films on Polyetheretherketone for Orthopedic Implants
(2021)
Passivated electrode side walls by atomic layer deposition on flexible polyimide based samples
(2020)
High voltage insulation properties of DLC-Parylene multilayer films for microsurgery instruments
(2016)