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- Encapsulation (5)
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Atomic Layer Deposition of Bioactive TiO2 Thin Films on Polyetheretherketone for Orthopedic Implants
(2021)
Feasibility of Parylene C for encapsulating piezoelectric actuators in active medical implants
(2023)
Parylene C is well-known as an encapsulation material for medical implants. Within the approach of miniaturization and automatization of a bone distractor, piezoelectric actuators were encapsulated with Parylene C. The stretchability of the polymer was investigated with respect to the encapsulation functionality of piezoelectric chips. We determined a linear yield strain of 1% of approximately 12-μm-thick Parylene C foil. Parylene C encapsulation withstands the mechanical stress of a minimum of 5×105 duty cycles by continuous actuation. The experiments demonstrate that elongation of the encapsulation on piezoelectric actuators and thus the elongation of Parylene C up to 0.8 mm are feasible.
High voltage insulation properties of DLC-Parylene multilayer films for microsurgery instruments
(2016)
Langzeitstabile Verkapselungsschichten mit integriertem Feuchtesensor für aktive Mikroimplantate
(2012)
Light-addressed sub-μm electrodes for extracellular recording and stimulation of excitable cells
(2001)
Novel method for plasma etching of printed circuit boards as alternative for fluorocarbon gases
(2023)