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Reinecke, Holger (15)
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(9)
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(14)
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Bonding
(2)
CD-ROM
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Force
(2)
Needles
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Porous silicon
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Silicon
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Mikrobearbeitung von Metallen und Keramiken mittels elektrochemischer und elektroerosiver Bearbeitung
(2010)
Reinecke, Holger
;
Hösel, T.
;
Müller, C.
Simulation of Current Density for Electroplating on Silicon Using a Hull Cell
(2012)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Contact Mechanics and Needle Like Surfaces for Micro-Nano Integration
(2012)
Keshavarzi, Shervin
;
Mescheder, Ulrich
;
Reinecke, Holger
;
Kovacs, Andras
Modeling the adhesion between nanoneedle surfaces bonded based on Velcro or Gecko principle
(2013)
Keshavarzi, Shervin
;
Mescheder, Ulrich
;
Reinecke, Holger
Electrochemical Impedance Spectroscopy of n-Si(100) Pre-etched by KOH or BHF
(2014)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon
(2014)
Keshavarzi, Shervin
;
Mescheder, Ulrich
;
Reinecke, Holger
Maskless Selective Electrodeposition on Silicon
(2014)
Lima, Frederico
;
Mescheder, Ulrich
;
Reinecke, Holger
Generation of microstructures on a Ti–6Al–4V substrate through anodization
(2015)
Soares, Tiago A.
;
Mozaffari Jovein, Hadi
;
Reinecke, Holger
Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique
(2015)
Keshavarzi, Shervin
;
Mescheder, Ulrich
;
Reinecke, Holger
Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon
(2015)
Lima, Frederico
;
Reinecke, Holger
;
Mescheder, Ulrich
1
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10