Refine
Document type
- Article (peer-reviewed) (5) (remove)
Language
- English (5)
Is part of the Bibliography
- Yes (5)
Keywords
- Material removal mechanism (2)
- Silicon nitride (2)
- Dry creep feed up grinding (1)
- Ductile grinding (1)
- Grinding (1)
- Grinding forces (1)
- Grinding temperature (1)
- Laser structuring (1)
- Laser-assisted grinding (1)
- Micro-grinding (1)
- SiC-Bonded diamond (1)
- Single diamond grit scratching (1)
- Specific cutting energy (1)
- Temperature distribution (1)
- Ultra-short pulse laser (1)
- Ultrashort-pulse laser (1)
- Ultrasonic vibration (1)