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Author
Leiste, Harald (2)
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Year of publication
2018
(1)
2019
(1)
Document type
Article (peer-reviewed)
(2)
Language
English
(2)
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Is part of the Bibliography
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Keywords
Copper diffusion
(1)
SNMS
(1)
Scratch test
(1)
Seedless electroplating
(1)
Silicon plating
(1)
XPS
(1)
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Influence of current density on the adhesion of seedless electrodeposited copper layers on silicon
(2019)
Lima, Frederico
;
Mescheder, Ulrich
;
Leiste, Harald
;
Claas, Müller
1
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