Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates
| Author: | Ulrike Passlack, Nicolai Simon, Volker BucherORCiDGND, Christine Harendt, Thomas Stieglitz, Joachim N. Burghartz |
|---|---|
| DOI: | https://doi.org/10.1021/acsami.2c22513 |
| ISSN: | 1944-8252 |
| Parent Title (English): | ACS Applied Materials & Interfaces |
| Document Type: | Article (peer-reviewed) |
| Language: | English |
| Year of Completion: | 2023 |
| Release Date: | 2023/03/21 |
| Tag: | Al2O3−TiO2 nanolaminates; Chip-film patch; Encapsulation; Plasma-enhanced atomic layer deposition; Polyimide PI-2611 |
| Volume: | 15.2023 |
| Issue: | 12 |
| First Page: | 16221 |
| Last Page: | 16231 |
| Licence (German): |  Urheberrechtlich geschützt |