Seedless electroplating: adhesion and charge transfer in galvanic processes
| Author: | Frederico Lima |
|---|---|
| DOI: | https://doi.org/10.6094/UNIFR/167272 |
| Advisor: | Ulrich Mescheder |
| Document Type: | Doctoral Thesis |
| Language: | English |
| Year of Completion: | 2020 |
| University: | Universität Freiburg |
| City of university: | Freiburg |
| Date of final exam: | 2020/02/10 |
| Release Date: | 2021/11/12 |
| Tag: | Adhesion measurement; Copper electrodeposition; Scratch test; Seedless electroplating; Silicon plating |
| Page Number: | 285 |
| Open-Access-Status: | Open Access |
| Licence (German): |  Urheberrechtlich geschützt |