Transfer, Assembly and Embedding of Small CMOS-Die Arrays for the Build-up of Flexible Smart Implants
| Document Type: | Article (peer-reviewed) |
|---|---|
| Author: | Andreas HeidGND, Marcio Camoleze de Andrade, Lena Bleck, Rene P. von Metzen, Dieter Kern, Jürgen Giehl, Volker BucherORCiDGND |
| DOI: | https://doi.org/10.1109/TCPMT.2019.2900564 |
| ISSN: | 2156-3950 |
| Parent Title (English): | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Language: | English |
| Year of Completion: | 2019 |
| Release Date: | 2019/03/20 |
| Tag: | Adhesives; Polymers; Printing; Substrates; Surface treatment |
| Volume: | 9.2019 |
| Issue: | 7 |
| First Page: | 1415 |
| Last Page: | 1425 |
| Open-Access-Status: | Closed Access |
| Licence (German): |  Urheberrechtlich geschützt |