Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers

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Author:Frederico Lima, Ulrich MeschederGND, Gabor L. Katona, Harald Leiste, Emre Özel, Claas Müller, Holger Reinecke
DOI:https://doi.org/10.1016/j.surfcoat.2018.03.044
ISSN:0257-8972
Parent Title (English):Surface and Coatings Technology
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2018
Release Date:2018/07/17
Tag:Copper diffusion; SNMS; Scratch test; Seedless electroplating; Silicon plating; XPS
Volume:349.2018
Issue:September
First Page:208
Last Page:216
Licence (German):License LogoEs gilt das UrhG