Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers
| Author: | Frederico Lima, Ulrich MeschederORCiDGND, Gabor L. Katona, Harald Leiste, Emre Özel, Claas Müller, Holger Reinecke |
|---|---|
| DOI: | https://doi.org/10.1016/j.surfcoat.2018.03.044 |
| ISSN: | 0257-8972 |
| Parent Title (English): | Surface and Coatings Technology |
| Document Type: | Article (peer-reviewed) |
| Language: | English |
| Year of Completion: | 2018 |
| Release Date: | 2018/07/17 |
| Tag: | Copper diffusion; SNMS; Scratch test; Seedless electroplating; Silicon plating; XPS |
| Volume: | 349.2018 |
| Issue: | September |
| First Page: | 208 |
| Last Page: | 216 |
| Licence (German): |  Urheberrechtlich geschützt |