Simulation of Current Density for Electroplating on Silicon Using a Hull Cell
| Author: | Frederico Lima, Ulrich MeschederORCiDGND, Holger Reinecke |
|---|---|
| URL: | https://www.comsol.eu/paper/download/151665/lima_paper.pdf |
| Parent Title (English): | Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012 |
| Document Type: | Conference Proceeding |
| Language: | English |
| Year of Completion: | 2012 |
| Release Date: | 2018/01/29 |
| Page Number: | 7 |
| Open-Access-Status: | Open Access |
| Licence (German): |  Urheberrechtlich geschützt |