Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon
| Author: | Shervin KeshavarziORCiDGND, Ulrich MeschederORCiDGND, Holger Reinecke |
|---|---|
| DOI: | https://doi.org/10.1109/MEMSYS.2014.6765842 |
| ISBN: | 978-1-4799-3509-3 |
| Parent Title (English): | MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco |
| Document Type: | Conference Proceeding |
| Language: | English |
| Year of Completion: | 2014 |
| Release Date: | 2018/01/23 |
| Tag: | Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Surface treatment |
| Page Number: | 4 |
| First Page: | 1119 |
| Last Page: | 1122 |
| Open-Access-Status: | Closed Access |
| Licence (German): |  Urheberrechtlich geschützt |