Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon
| Author: | Frederico Lima, Holger Reinecke, Ulrich MeschederORCiDGND |
|---|---|
| ISBN: | 978-3-8007-4100-7 |
| Parent Title (German): | MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe |
| Publisher: | VDE-Verlag |
| Place of publication: | Berlin |
| Document Type: | Conference Proceeding |
| Language: | English |
| Year of Completion: | 2015 |
| Release Date: | 2016/12/14 |
| Tag: | CD-ROM |
| First Page: | 409 |
| Last Page: | 412 |
| Licence (German): |  Urheberrechtlich geschützt |