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Examination of dielectric strength of thin Parylene C films under various conditions

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Metadaten
Author:Andreas Heid, Rene P. von Metzen, Alfred Stett, Volker Bucher
DOI:https://doi.org/10.1515/cdbme-2016-0012
ISSN:2364-5504
Parent Title (English):Current Directions in Biomedical Engineering
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2016
Release Date:2017/06/22
Tag:Dielectric strength; Encapsulation; Implant; Insulation; Parylene C
Volume:2.2016
Issue:1
First Page:39
Last Page:41
Open Access:Frei verf├╝gbar
Licence (German):License LogoCreative Commons - Namensnennung-Nicht kommerziell-Keine Bearbeitung