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Examination of dielectric strength of thin Parylene C films under various conditions

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Author:Andreas HeidGND, Rene P. von Metzen, Alfred Stett, Volker BucherORCiDGND
URN:https://urn:nbn:de:bsz:fn1-opus4-20239
DOI:https://doi.org/10.1515/cdbme-2016-0012
ISSN:2364-5504
Parent Title (English):Current Directions in Biomedical Engineering
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2016
Release Date:2017/06/22
Tag:Dielectric strength; Encapsulation; Implant; Insulation; Parylene C
Volume:2.2016
Issue:1
First Page:39
Last Page:41
Open-Access-Status: Open Access 
Licence (German):License LogoCreative Commons - Namensnennung, Nicht kommerziell, Keine Bearbeitung 3.0