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Transfer, Assembly and Embedding of Small CMOS-Die Arrays for the Build-up of Flexible Smart Implants

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Author:Andreas Heid, Marcio Camoleze de Andrade, Lena Bleck, Rene P. von Metzen, Dieter Kern, Jürgen Giehl, Volker Bucher
DOI:https://doi.org/10.1109/TCPMT.2019.2900564
ISSN:2156-3950
Parent Title (English):IEEE Transactions on Components, Packaging and Manufacturing Technology
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2019
Release Date:2019/03/20
Tag:Adhesives; Polymers; Printing; Substrates; Surface treatment
Volume:9.2019
Issue:7
First Page:1415
Last Page:1425
Open Access:Innerhalb der Hochschule
Licence (German):License LogoEs gilt das UrhG