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Copper electrodeposition on silicon electrodes

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Author:Frederico Lima, Ulrich MeschederORCiDGND, C. Müller, Holger Reinecke
DOI:https://doi.org/10.1504/IJSURFSE.2018.091228
ISSN:1749-7868
Parent Title (English):International Journal of Surface Science and Engineering
Document Type:Article (peer-reviewed)
Language:English
Year of Completion:2018
Release Date:2018/07/17
Volume:12.2018
Issue:2
First Page:99
Last Page:118
Licence (German):License LogoEs gilt das UrhG