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Simulation of Current Density for Electroplating on Silicon Using a Hull Cell

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Author:Frederico Lima, Ulrich MeschederORCiDGND, Holger Reinecke
URL:https://www.comsol.eu/paper/download/151665/lima_paper.pdf
Parent Title (English):Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012
Document Type:Conference Proceeding
Language:English
Year of Completion:2012
Release Date:2018/01/29
Page Number:7
Open Access :Frei verf├╝gbar
Licence (German):License LogoEs gilt das UrhG