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Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon

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Author:Shervin KeshavarziORCiD, Ulrich MeschederORCiDGND, Holger Reinecke
Parent Title (English):MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco
Document Type:Conference Proceeding
Year of Completion:2014
Release Date:2018/01/23
Tag:Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Surface treatment
First Page:1119
Last Page:1122
Open Access:Innerhalb der Hochschule
Licence (German):License LogoEs gilt das UrhG