Local laser bonding for low temperature budget
| Author: | Ulrich MeschederORCiDGND, M. Alavi, K. Hiltmann, Ch. Lietzau, Christoph Nachtigall, H. Sandmaier |
|---|---|
| DOI: | https://doi.org/10.1016/S0924-4247(01)00871-8 |
| ISSN: | 0924-4247 |
| Parent Title (English): | Sensors and Actuators A: Physical |
| Document Type: | Article (peer-reviewed) |
| Language: | English |
| Year of Completion: | 2002 |
| Release Date: | 2018/02/27 |
| Tag: | Eutectic bonding; Laser micromachining; Wafer bonding |
| Volume: | 97-98.2002 |
| Issue: | April |
| First Page: | 422 |
| Last Page: | 427 |
| Open-Access-Status: | Closed Access |
| Licence (German): |  Urheberrechtlich geschützt |