Influence of current density on the adhesion of seedless electrodeposited copper layers on silicon
Author: | Frederico Lima, Ulrich MeschederORCiDGND, Harald Leiste, Müller Claas |
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DOI: | https://doi.org/10.1016/j.surfcoat.2019.07.007 |
ISSN: | 0257-8972 |
Parent Title (English): | Surface and Coatings Technology |
Document Type: | Article (peer-reviewed) |
Language: | English |
Year of Completion: | 2019 |
Release Date: | 2019/12/12 |
Volume: | 375.2019 |
Issue: | October |
First Page: | 554 |
Last Page: | 564 |
Licence (German): | Urheberrechtlich geschützt |