Influence of current density on the adhesion of seedless electrodeposited copper layers on silicon
| Author: | Frederico Lima, Ulrich MeschederORCiDGND, Harald Leiste, Müller Claas |
|---|---|
| DOI: | https://doi.org/10.1016/j.surfcoat.2019.07.007 |
| ISSN: | 0257-8972 |
| Parent Title (English): | Surface and Coatings Technology |
| Document Type: | Article (peer-reviewed) |
| Language: | English |
| Year of Completion: | 2019 |
| Release Date: | 2019/12/12 |
| Volume: | 375.2019 |
| Issue: | October |
| First Page: | 554 |
| Last Page: | 564 |
| Licence (German): |  Urheberrechtlich geschützt |