TY  - CHAP
A1  - Lima, Frederico
A1  - Reinecke, Holger
A1  - Mescheder, Ulrich
T1  - Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon
T2  - MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe
KW  - CD-ROM
Y1  - 2015
SN  - 978-3-8007-4100-7
SP  - 409
EP  - 412
PB  - VDE-Verlag
CY  - Berlin
ER  - 
TY  - CHAP
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Modeling the adhesion between nanoneedle surfaces bonded based on Velcro or Gecko principle
T2  - Von Bauelementen zu Systemen : proceedings / Mikrosystemtechnik-Kongress 2013, 14. - 16. Oktober 2013 in Aachen
KW  - CD-ROM
Y1  - 2013
SN  - 978-3-8007-3555-6
SP  - 864
EP  - 867
PB  - VDE-Verlag
CY  - Berlin
ER  -