TY - JOUR A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Katona, Gabor L. A1 - Leiste, Harald A1 - Özel, Emre A1 - Müller, Claas A1 - Reinecke, Holger T1 - Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers JF - Surface and Coatings Technology KW - Seedless electroplating KW - Scratch test KW - Copper diffusion KW - Silicon plating KW - XPS KW - SNMS Y1 - 2018 U6 - http://dx.doi.org/10.1016/j.surfcoat.2018.03.044 SN - 0257-8972 VL - 349.2018 IS - September SP - 208 EP - 216 ER - TY - CHAP A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Maskless Selective Electrodeposition on Silicon T2 - The 65th Annual Meeting of the International Society of Electrochemistry: Ubiquitous Electrochemistry; 31 August-5 September 2014, Lausanne, Switzerland Y1 - 2014 UR - http://www.ise-online.org/ise-conferences/annmeet/folder/2014-LAUSANNE-BoA.pdf ER - TY - CHAP A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Simulation of Current Density for Electroplating on Silicon Using a Hull Cell T2 - Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012 Y1 - 2012 UR - https://www.comsol.eu/paper/download/151665/lima_paper.pdf ER - TY - JOUR A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Müller, C. A1 - Reinecke, Holger T1 - Copper electrodeposition on silicon electrodes JF - International Journal of Surface Science and Engineering Y1 - 2018 U6 - http://dx.doi.org/10.1504/IJSURFSE.2018.091228 SN - 1749-7868 VL - 12.2018 IS - 2 SP - 99 EP - 118 ER - TY - CHAP A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Electrochemical Impedance Spectroscopy of n-Si(100) Pre-etched by KOH or BHF T2 - 10th International Symposium on Electrochemical Impedance Analysis, June 1-5, 2014, Borovets, Bulgaria Y1 - 2014 UR - http://www.jic-bas.eu/eia10/files/EIA10_BookOfAbstracts.pdf ER - TY - CHAP A1 - Lima, Frederico A1 - Reinecke, Holger A1 - Mescheder, Ulrich T1 - Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon T2 - MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe KW - CD-ROM Y1 - 2015 SN - 978-3-8007-4100-7 SP - 409 EP - 412 PB - VDE-Verlag CY - Berlin ER - TY - CHAP A1 - Reinecke, Holger A1 - Hösel, T. A1 - Müller, C. T1 - Mikrobearbeitung von Metallen und Keramiken mittels elektrochemischer und elektroerosiver Bearbeitung T2 - Moderne Schleiftechnologie und Feinstbearbeitung 2010 : neue Entwicklungen und Trends aus Forschung und Praxis / 8. Seminar "Moderne Schleiftechnologie und Feinstbearbeitung" am 11.05.2010 in Stuttgart Y1 - 2010 SN - 978-3-8027-2957-7 SP - 15-1 EP - 15-7 PB - Vulkan Verlag CY - Villingen-Schwenningen ER - TY - JOUR A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Effect of Capillary Forces in Room Temperature Si-Si Direct Bonding Technique Using Velcrolike Surfaces JF - Journal of Microelectromechanical Systems KW - Porous silicon KW - Si-Si direct bonding KW - Adhesion KW - Capillary forces Y1 - 2017 U6 - http://dx.doi.org/10.1109/JMEMS.2016.2646759 SN - 1057-7157 VL - 26.2017 IS - 2 SP - 385 EP - 395 ER - TY - CHAP A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon T2 - MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco KW - Needles KW - Bonding KW - Force KW - Surface morphology KW - Silicon KW - Surface treatment KW - Substrates Y1 - 2014 SN - 978-1-4799-3509-3 U6 - http://dx.doi.org/10.1109/MEMSYS.2014.6765842 SP - 1119 EP - 1122 ER - TY - CHAP A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger A1 - Kovacs, Andras T1 - Contact Mechanics and Needle Like Surfaces for Micro-Nano Integration T2 - 23rd Micromechanics and Microsystems Europe Workshop: MME 2012, September 9 - 12, Ilmenau, Germany Y1 - 2012 UR - https://www.tu-ilmenau.de/fileadmin/media/mme2012/Proceedings/Session_D/D15_1692_MME2012_120703.pdf ER - TY - CHAP A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique T2 - 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015 KW - Needles KW - Bonding KW - Force KW - Surface morphology KW - Silicon KW - Temperature measurement KW - Substrates Y1 - 2015 SN - 978-1-4799-7955-4 U6 - http://dx.doi.org/10.1109/MEMSYS.2015.7050977 SP - 413 EP - 416 ER - TY - CHAP A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Modeling the adhesion between nanoneedle surfaces bonded based on Velcro or Gecko principle T2 - Von Bauelementen zu Systemen : proceedings / Mikrosystemtechnik-Kongress 2013, 14. - 16. Oktober 2013 in Aachen KW - CD-ROM Y1 - 2013 SN - 978-3-8007-3555-6 SP - 864 EP - 867 PB - VDE-Verlag CY - Berlin ER - TY - JOUR A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces JF - Journal of Microelectromechanical Systems KW - Porous silicon KW - Velcro principle KW - Direct bonding KW - van der Waals force Y1 - 2016 U6 - http://dx.doi.org/10.1109/JMEMS.2016.2519823 SN - 1941-0158 VL - 25.2016 IS - 2 SP - 371 EP - 379 ER - TY - JOUR A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Formation Mechanisms of Self-Organized Needles in Porous Silicon Based Needle-Like Surfaces JF - Journal of The Electrochemical Society Y1 - 2018 U6 - http://dx.doi.org/10.1149/2.0501803jes SN - 1945-7111 VL - 165.2018 IS - 3 SP - E108 EP - E114 ER - TY - JOUR A1 - Soares, Tiago A. A1 - Mozaffari-Jovein, Hadi A1 - Reinecke, Holger T1 - Generation of microstructures on a Ti–6Al–4V substrate through anodization JF - Surface & Coatings Technology KW - Ti-alloy KW - Anodization KW - X-ray diffraction KW - Microstructure KW - Bioactivity KW - Nano-layer Y1 - 2015 U6 - http://dx.doi.org/10.1016/j.surfcoat.2015.07.040 SN - 0257-8972 VL - 278.2015 SP - 64 EP - 70 ER -