TY  - JOUR
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Katona, Gabor L.
A1  - Leiste, Harald
A1  - Özel, Emre
A1  - Müller, Claas
A1  - Reinecke, Holger
T1  - Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers
JF  - Surface and Coatings Technology
KW  - Seedless electroplating
KW  - Scratch test
KW  - Copper diffusion
KW  - Silicon plating
KW  - XPS
KW  - SNMS
Y1  - 2018
U6  - http://dx.doi.org/10.1016/j.surfcoat.2018.03.044
SN  - 0257-8972
VL  - 349.2018
IS  - September
SP  - 208
EP  - 216
ER  - 
TY  - CHAP
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Maskless Selective Electrodeposition on Silicon
T2  - The 65th Annual Meeting of the International Society of Electrochemistry: Ubiquitous Electrochemistry; 31 August-5 September 2014, Lausanne, Switzerland
Y1  - 2014
UR  - http://www.ise-online.org/ise-conferences/annmeet/folder/2014-LAUSANNE-BoA.pdf
ER  - 
TY  - CHAP
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Simulation of Current Density for Electroplating on Silicon Using a Hull Cell
T2  - Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012
Y1  - 2012
UR  - https://www.comsol.eu/paper/download/151665/lima_paper.pdf
ER  - 
TY  - JOUR
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Müller, C.
A1  - Reinecke, Holger
T1  - Copper electrodeposition on silicon electrodes
JF  - International Journal of Surface Science and Engineering
Y1  - 2018
U6  - http://dx.doi.org/10.1504/IJSURFSE.2018.091228
SN  - 1749-7868
VL  - 12.2018
IS  - 2
SP  - 99
EP  - 118
ER  - 
TY  - CHAP
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Electrochemical Impedance Spectroscopy of n-Si(100) Pre-etched by KOH or BHF
T2  - 10th International Symposium on Electrochemical Impedance Analysis, June 1-5, 2014, Borovets, Bulgaria
Y1  - 2014
UR  - http://www.jic-bas.eu/eia10/files/EIA10_BookOfAbstracts.pdf
ER  - 
TY  - CHAP
A1  - Lima, Frederico
A1  - Reinecke, Holger
A1  - Mescheder, Ulrich
T1  - Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon
T2  - MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe
KW  - CD-ROM
Y1  - 2015
SN  - 978-3-8007-4100-7
SP  - 409
EP  - 412
PB  - VDE-Verlag
CY  - Berlin
ER  - 
TY  - CHAP
A1  - Reinecke, Holger
A1  - Hösel, T.
A1  - Müller, C.
T1  - Mikrobearbeitung von Metallen und Keramiken mittels elektrochemischer und elektroerosiver Bearbeitung
T2  - Moderne Schleiftechnologie und Feinstbearbeitung 2010 : neue Entwicklungen und Trends aus Forschung und Praxis / 8. Seminar "Moderne Schleiftechnologie und Feinstbearbeitung" am 11.05.2010 in Stuttgart
Y1  - 2010
SN  - 978-3-8027-2957-7
SP  - 15-1
EP  - 15-7
PB  - Vulkan Verlag
CY  - Villingen-Schwenningen
ER  - 
TY  - JOUR
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Effect of Capillary Forces in Room Temperature Si-Si Direct Bonding Technique Using Velcrolike Surfaces
JF  - Journal of Microelectromechanical Systems
KW  - Porous silicon
KW  - Si-Si direct bonding
KW  - Adhesion
KW  - Capillary forces
Y1  - 2017
U6  - http://dx.doi.org/10.1109/JMEMS.2016.2646759
SN  - 1057-7157
VL  - 26.2017
IS  - 2
SP  - 385
EP  - 395
ER  - 
TY  - CHAP
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon
T2  - MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco
KW  - Needles
KW  - Bonding
KW  - Force
KW  - Surface morphology
KW  - Silicon
KW  - Surface treatment
KW  - Substrates
Y1  - 2014
SN  - 978-1-4799-3509-3
U6  - http://dx.doi.org/10.1109/MEMSYS.2014.6765842
SP  - 1119
EP  - 1122
ER  - 
TY  - CHAP
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
A1  - Kovacs, Andras
T1  - Contact Mechanics and Needle Like Surfaces for Micro-Nano Integration
T2  - 23rd Micromechanics and Microsystems Europe Workshop: MME 2012, September 9 - 12, Ilmenau, Germany
Y1  - 2012
UR  - https://www.tu-ilmenau.de/fileadmin/media/mme2012/Proceedings/Session_D/D15_1692_MME2012_120703.pdf
ER  - 
TY  - CHAP
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique
T2  - 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015
KW  - Needles
KW  - Bonding
KW  - Force
KW  - Surface morphology
KW  - Silicon
KW  - Temperature measurement
KW  - Substrates
Y1  - 2015
SN  - 978-1-4799-7955-4
U6  - http://dx.doi.org/10.1109/MEMSYS.2015.7050977
SP  - 413
EP  - 416
ER  - 
TY  - CHAP
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Modeling the adhesion between nanoneedle surfaces bonded based on Velcro or Gecko principle
T2  - Von Bauelementen zu Systemen : proceedings / Mikrosystemtechnik-Kongress 2013, 14. - 16. Oktober 2013 in Aachen
KW  - CD-ROM
Y1  - 2013
SN  - 978-3-8007-3555-6
SP  - 864
EP  - 867
PB  - VDE-Verlag
CY  - Berlin
ER  - 
TY  - JOUR
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces
JF  - Journal of Microelectromechanical Systems
KW  - Porous silicon
KW  - Velcro principle
KW  - Direct bonding
KW  - van der Waals force
Y1  - 2016
U6  - http://dx.doi.org/10.1109/JMEMS.2016.2519823
SN  - 1941-0158
VL  - 25.2016
IS  - 2
SP  - 371
EP  - 379
ER  - 
TY  - JOUR
A1  - Keshavarzi, Shervin
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Formation Mechanisms of Self-Organized Needles in Porous Silicon Based Needle-Like Surfaces
JF  - Journal of The Electrochemical Society
Y1  - 2018
U6  - http://dx.doi.org/10.1149/2.0501803jes
SN  - 1945-7111
VL  - 165.2018
IS  - 3
SP  - E108
EP  - E114
ER  - 
TY  - JOUR
A1  - Soares, Tiago A.
A1  - Mozaffari-Jovein, Hadi
A1  - Reinecke, Holger
T1  - Generation of microstructures on a Ti–6Al–4V substrate through anodization
JF  - Surface & Coatings Technology
KW  - Ti-alloy
KW  - Anodization
KW  - X-ray diffraction
KW  - Microstructure
KW  - Bioactivity
KW  - Nano-layer
Y1  - 2015
U6  - http://dx.doi.org/10.1016/j.surfcoat.2015.07.040
SN  - 0257-8972
VL  - 278.2015
SP  - 64
EP  - 70
ER  -