@inproceedings{KeshavarziMeschederReinecke2015,
  author    = {Keshavarzi, Shervin and Mescheder, Ulrich and Reinecke, Holger},
  title     = {Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique},
  series = {28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015},
  isbn      = {978-1-4799-7955-4},
  doi       = {10.1109/MEMSYS.2015.7050977},
  pages     = {413 -- 416},
  year      = {2015},
  language  = {en}
}
@inproceedings{KeshavarziMeschederReinecke2014,
  author    = {Keshavarzi, Shervin and Mescheder, Ulrich and Reinecke, Holger},
  title     = {Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon},
  series = {MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco},
  isbn      = {978-1-4799-3509-3},
  doi       = {10.1109/MEMSYS.2014.6765842},
  pages     = {1119 -- 1122},
  year      = {2014},
  language  = {en}
}