TY  - THES
U1  - Dissertation / Habilitation
A1  - Lima, Frederico
T1  - Seedless electroplating: adhesion and charge transfer in galvanic processes
KW  - Seedless electroplating
KW  - Copper electrodeposition
KW  - Silicon plating
KW  - Scratch test
KW  - Adhesion measurement
Y2  - 2020
U6  - https://doi.org/10.6094/UNIFR/167272
DO  - https://doi.org/10.6094/UNIFR/167272
SP  - 285
S1  - 285
ER  -