TY - JOUR U1 - Wissenschaftlicher Artikel A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Katona, Gabor L. A1 - Leiste, Harald A1 - Özel, Emre A1 - Müller, Claas A1 - Reinecke, Holger T1 - Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers JF - Surface and Coatings Technology KW - Seedless electroplating KW - Scratch test KW - Copper diffusion KW - Silicon plating KW - XPS KW - SNMS Y1 - 2018 SN - 0257-8972 SS - 0257-8972 U6 - https://doi.org/10.1016/j.surfcoat.2018.03.044 DO - https://doi.org/10.1016/j.surfcoat.2018.03.044 VL - 349.2018 IS - September SP - 208 EP - 216 ER -