TY - CPAPER U1 - Konferenzveröffentlichung A1 - Lima, Frederico A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Simulation of Current Density for Electroplating on Silicon Using a Hull Cell T2 - Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012 Y1 - 2012 UR - https://www.comsol.eu/paper/download/151665/lima_paper.pdf SP - 7 S1 - 7 ER -