TY - CHAP U1 - Konferenzveröffentlichung A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Bonding Mechanism in the Velcro Concept Si-Si Low Temperature Direct Bonding Technique T2 - 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, 2015 KW - Needles KW - Bonding KW - Force KW - Surface morphology KW - Silicon KW - Temperature measurement KW - Substrates Y1 - 2015 SN - 978-1-4799-7955-4 SB - 978-1-4799-7955-4 U6 - https://doi.org/10.1109/MEMSYS.2015.7050977 DO - https://doi.org/10.1109/MEMSYS.2015.7050977 SP - 413 EP - 416 ER -