TY - CHAP U1 - Konferenzveröffentlichung A1 - Keshavarzi, Shervin A1 - Mescheder, Ulrich A1 - Reinecke, Holger T1 - Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon T2 - MEMS 2014: The 27th IEEE International Conference on Micro Electro Mechanical Systems, January 26-30, 2014, San Francisco KW - Needles KW - Bonding KW - Force KW - Surface morphology KW - Silicon KW - Surface treatment KW - Substrates Y1 - 2014 SN - 978-1-4799-3509-3 SB - 978-1-4799-3509-3 U6 - https://doi.org/10.1109/MEMSYS.2014.6765842 DO - https://doi.org/10.1109/MEMSYS.2014.6765842 SP - 1119 EP - 1122 S1 - 4 ER -