TY - JOUR U1 - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed) A1 - Heid, Andreas A1 - Camoleze de Andrade, Marcio A1 - Bleck, Lena A1 - Metzen, Rene P. von A1 - Kern, Dieter A1 - Giehl, Jürgen A1 - Bucher, Volker T1 - Transfer, Assembly and Embedding of Small CMOS-Die Arrays for the Build-up of Flexible Smart Implants JF - IEEE Transactions on Components, Packaging and Manufacturing Technology KW - Substrates KW - Surface treatment KW - Printing KW - Adhesives KW - Polymers Y1 - 2019 SN - 2156-3950 SS - 2156-3950 U6 - https://doi.org/10.1109/TCPMT.2019.2900564 DO - https://doi.org/10.1109/TCPMT.2019.2900564 VL - 9.2019 IS - 7 SP - 1415 EP - 1425 ER -