TY  - JOUR
U1  - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed)
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Katona, Gabor L.
A1  - Leiste, Harald
A1  - Özel, Emre
A1  - Müller, Claas
A1  - Reinecke, Holger
T1  - Influence of silicon doping type on the adhesion of seedless electrodeposited copper layers
JF  - Surface and Coatings Technology
KW  - Seedless electroplating
KW  - Scratch test
KW  - Copper diffusion
KW  - Silicon plating
KW  - XPS
KW  - SNMS
Y1  - 2018
SN  - 0257-8972
SS  - 0257-8972
U6  - https://doi.org/10.1016/j.surfcoat.2018.03.044
DO  - https://doi.org/10.1016/j.surfcoat.2018.03.044
VL  - 349.2018
IS  - September
SP  - 208
EP  - 216
ER  -