@inproceedings{LimaReineckeMescheder2015,
  author    = {Frederico Lima and Holger Reinecke and Ulrich Mescheder},
  title     = {Adhesion of Continuous and Homogeneous Electrodeposited Copper Layers on Silicon},
  series = {MEMS, Mikroelektronik, Systeme : proceedings ; MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015 in Karlsruhe},
  publisher = {VDE-Verlag},
  address   = {Berlin},
  isbn      = {978-3-8007-4100-7},
  pages     = {409 -- 412},
  year      = {2015},
  language  = {en}
}