TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Ivanov, Alexey
A1  - Mescheder, Ulrich
T1  - Dynamic Simulation of Electrochemical Etching of Silicon with COMSOL
T2  - Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012
Y1  - 2012
UR  - https://www.comsol.de/paper/dynamic-simulation-of-electrochemical-etching-of-silicon-with-comsol-13379
SP  - 7
S1  - 7
ER  -