TY - JOUR U1 - Zeitschriftenartikel, wissenschaftlich - begutachtet (reviewed) A1 - Passlack, Ulrike A1 - Simon, Nicolai A1 - Bucher, Volker A1 - Harendt, Christine A1 - Stieglitz, Thomas A1 - Burghartz, Joachim N. T1 - Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates JF - ACS Applied Materials & Interfaces KW - Polyimide PI-2611 KW - Chip-film patch KW - Plasma-enhanced atomic layer deposition KW - Al2O3−TiO2 nanolaminates KW - Encapsulation Y1 - 2023 SN - 1944-8252 SS - 1944-8252 U6 - https://doi.org/10.1021/acsami.2c22513 DO - https://doi.org/10.1021/acsami.2c22513 VL - 15.2023 IS - 12 SP - 16221 EP - 16231 ER -