@article{HeidCamolezedeAndradeBlecketal.2019,
  author    = {Andreas Heid and Marcio Camoleze de Andrade and Lena Bleck and Rene P. von Metzen and Dieter Kern and J{\"u}rgen Giehl and Volker Bucher},
  title     = {Transfer, Assembly and Embedding of Small CMOS-Die Arrays for the Build-up of Flexible Smart Implants},
  series   = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume    = {9.2019},
  number    = {7},
  issn      = {2156-3950},
  doi       = {10.1109/TCPMT.2019.2900564},
  pages     = {1415 -- 1425},
  year      = {2019},
  language  = {en}
}