TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Lima, Frederico
A1  - Mescheder, Ulrich
A1  - Reinecke, Holger
T1  - Simulation of Current Density for Electroplating on Silicon Using a Hull Cell
T2  - Proceedings COMSOL Conference, Milan, Italy, 10.-12.10.2012
Y1  - 2012
UR  - https://www.comsol.eu/paper/download/151665/lima_paper.pdf
SP  - 7
S1  - 7
ER  -